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LS-NUN

Laser Depaneling System

  • Use various Laser source as UV, Green, IR, etc.

  • Cutting materials : FR4, FPCBs, Kapton, etc.

  • Thickness up to 1.2mm in the case of FR4 PCB

  • Pin Table, Production fixture

  • Full-cut process, Support high populated PCB panel

  • Best cutting quality(Minimize charring)

  • Clean process of particle and fume removal

Features

  • Easy setup of BDS(Beam Delivery System)

  • Automated Laser power management

  • Apply the optimized optic system

  • Incredible cost performance using 2 Table

  • Full graphic interface and easy programming

  • Real-time monitoring of key process parameters

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